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Black OEM Si3N4 Silicon Nitride Ceramics Non Standard Structural

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Black OEM Si3N4 Silicon Nitride Ceramics Non Standard Structural

Brand Name : KEGU

Place of Origin : China

Price : 200-500 yuan/kg

Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram

Supply Ability : 2,000 pcs/month

Packaging Details : Strong wooden box for Global shipping

Model Number : Customizable

Material : Silicon Nitride

Composition:SiC : >85%

Color : Black

Density : 3.20-3.26g/cm3

Max. Service Temp : 1450℃

Flexural Strength : 250MPa

Sample : Customizable

Chemical Stability : High

Apparent Porosity : 0-0.1%

Elastic Modulus : 300-320GPa

Compression Strength : >1500MPa

Vickers Hardness(HV0.5) : 15-16GPa

Thermal Conductivity : 20-25W/(m.k)

Specific Resistivity : 10^14Ω·cm

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Black OEM Si3N4 Silicon Nitride Ceramics Non Standard Structural

High-performance silicon nitride ceramic materials developed for the aluminum industry has significantly improved thermal and mechanical properties than similar products. On this basis, the "L-shaped high thermal conductivity submerged heating "Appliance" will bring revolutionary progress to aluminum industrial equipment.

Special structural parts with high requirements for thermal shock resistance are areas where silicon nitride ceramic materials can be vigorously developed in the future. In application areas with high temperature, strong corrosion, and high wear resistance, silicon nitride ceramics are used to replace some cemented carbide, alumina, Materials such as zirconia and silicon carbide will become a trend.

Black OEM Si3N4 Silicon Nitride Ceramics Non Standard Structural

Silicon Nitride Related Data

Main component 99%Al2O3 S-SiC ZrO2 Si3N4
Physical
Property
Density g/cm3 3.9 3.1 6 3.2
Water Absorption % 0 0.1 0 0.1
Sinter Temperature °C 1700 2200 1500 1800
Mechanical
Property
Rockwell Hardness HV 1700 2200 1300 1400
Bend Strength kgf/mm2 3500 4000 9000 7000
Compression Intensity Kgf/mm2 30000 20000 20000 23000
Thermal
Property
Maximum working
temperature
°C 1500 1600 1300 1400
thermal expansion
coefficient
0-1000°C
/°C 8.0*10-6 4.1*10-6(0-500°C) 9.5*10-6 2.0*10-6(0-500°C)
5.2*10-6(500-1000°C) 4.0*10-6(500-1000°C)
Thermal Shock resistance T(°C) 200 250 300 400-500
Thermal Conductivity W/m.k(25°C 31 100 3 25
300°C) 16 100 3 25
Electrical
Property
Resisting rate of Volume ◎.cm        
20°C >1012 106-108 >1010 >1011
100°C 1012-1013 >1011
300°C >1012 >1011
Insulation Breakdown
Intensity
KV/mm 18 semiconductor 9 17.7
Dielectric Constant (1 MHz) (E) 10 29 7
Dielectric Dissipation (tg o) 0.4*10-3

Black OEM Si3N4 Silicon Nitride Ceramics Non Standard Structural


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Si3N4 Silicon Nitride Ceramics

      

OEM Silicon Nitride Ceramics

      

Black Si3N4 Ceramics

      
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